以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
（二）阻碍国家机关工作人员依法执行职务的；
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In 1992, in a small shop in British Columbia, a sign maker named Blair Gran stared at a wall full of half-finished jobs and felt something click. Sign-making was treated like a commodity — orders in, banners out — but as thousands of signs came through his shop, he couldn’t help but notice the difference between the good ones and the bad ones. He could see that every sign that left his shop was either helping a business get noticed, or letting it disappear in plain sight.
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Виктория Кондратьева (Редактор отдела «Мир»)